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Stock impact report

ACM Research Introduces New Tools for Advanced Metal Plating

ACM Research, Inc. - Class A (ACMR) 
Last acm research, inc. - class a earnings: 3/18 04:10 pm Check Earnings Report
US:NASDAQ Investor Relations: ir.acmrcsh.com
Company Research Source: GlobeNewswire
FREMONT, Calif., March 18, 2019 (GLOBE NEWSWIRE) -- ACM Research, Inc. (“ACM” or the “Company”) (NASDAQ:ACMR), a provider of single-wafer wet cleaning equipment used by manufacturers of advanced semiconductors, today announced two new semiconductor electro-plating tools at SEMICON China.  ACM’s Ultra ECP AP, or “Advanced Wafer Level Packaging,” is a back-end assembly tool used for bumping, or applying copper, tin and nickel to semiconductor wafers at the die level prior to packaging.  The Ultra ECP AP delivers better plating performance in the form of a more uniform metal layer at the notch area by using ACM’s proprietary technology.  This advanced technology solution delivers better yields, greater plating efficiency and higher throughput during the fabrication process. ACM’s solution can also support a wide range of packaging solutions, such as Cu pillar, solder bump, RDL, fan-out application, TSV and gold bump.  ACM’s Ultra ECP MAP, or “Multi Anode Partial Plating,” is used in Show less Read more
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