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Stock impact report

Global Flip Chip Packages Market 2018-2022

ASE Technology Holding Co., Ltd. American Depositary Shares (each representing Two Common Shares) (ASX) 
Last ase technology holding co., ltd. american depositary shares (each representing two common shares) earnings: 2/7 01:00 am Check Earnings Report
US:NYSE Investor Relations: ir.aseglobal.com
Company Research Source: PR Newswire
NEW YORK, Sept. 18, 2018 /PRNewswire/ -- About Flip Chip PackagingFlip chip is a packaging technology that interconnects chips and package carriers or substrates with conductive bumps. The use of the technology in semiconductor chip packaging ensures a direct electrical connection of face-down electronic dies with organic or ceramic circuit boards using conductive bumps on the chip bond pads.Read the full report: https://www.reportlinker.com/p05501586 Technavio's analysts forecast the global flip chip packages market to grow at a CAGR of 6.35% during the period 2018-2022.Covered in this reportThe report covers the present scenario and the growth prospects of the global flip chip packages market for 2018-2022. To calculate the market size, the report considers the sales of semiconductor devices based on flip chip packaging technology to end-user sectors including communication, computing and networking, industrial, and automotive.The market is divided into the following segments based Show less Read more
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