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Stockreport

Broadcom Delivers Industry’s First 3.5D F2F Technology for AI XPUs

Broadcom Inc. (AVGO)  More Company Research Source: GlobeNewswire
Last broadcom inc. earnings: 3/12 04:15 pm Check Earnings Report
US:NASDAQ Investor Relations: investors.broadcom.com
PALO ALTO, Calif., Dec. 05, 2024 (GLOBE NEWSWIRE) -- Broadcom Inc. (NASDAQ: AVGO) today announced the availability of its 3.5D eXtreme Dimension System in Package (XDSiP™) platform technology, enabling consumer AI customers to develop next-generation custom accelerators (XPUs). The 3.5D XDSiP integrates more than 6000 mm2 of silicon and up to 12 high bandwidth memory (HBM) stacks in one packaged device to enable high-efficiency, low-power computing for AI at scale. Broadcom has achieved a significant milestone by developing and launching the industry's first Face-to-Face (F2F) 3.5D XPU. The immense computational power required for training generative AI models relies on massive clusters of 100,000 growing to 1 million XPUs. These XPUs demand increasingly sophisticated integration of compute, memory, and I/O capabilities to achieve the necessary performance while minimizing power consumption and cost. Traditional methods like Moore's Law and process scaling are struggling to keep up [Read more]
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Stockreport

Broadcom Delivers Industry’s First 3.5D F2F Technology for AI XPUs

Broadcom Inc.  (AVGO) 
More Company Research Source: GlobeNewswire
Last broadcom inc. earnings: 3/12 04:15 pm Check Earnings Report
US:NASDAQ Investor Relations: investors.broadcom.com
PALO ALTO, Calif., Dec. 05, 2024 (GLOBE NEWSWIRE) -- Broadcom Inc. (NASDAQ: AVGO) today announced the availability of its 3.5D eXtreme Dimension System in Package (XDSiP™) platform technology, enabling consumer AI customers to develop next-generation custom accelerators (XPUs). The 3.5D XDSiP integrates more than 6000 mm2 of silicon and up to 12 high bandwidth memory (HBM) stacks in one packaged device to enable high-efficiency, low-power computing for AI at scale. Broadcom has achieved a significant milestone by developing and launching the industry's first Face-to-Face (F2F) 3.5D XPU. The immense computational power required for training generative AI models relies on massive clusters of 100,000 growing to 1 million XPUs. These XPUs demand increasingly sophisticated integration of compute, memory, and I/O capabilities to achieve the necessary performance while minimizing power consumption and cost. Traditional methods like Moore's Law and process scaling are struggling to keep up [Read more]
IMPACT SNAPSHOT
EVENT TIME:
AVGO
Last Price
Price Change
Price Change %
Volume Shares
Max Up
Max Down
Volume Ratio
%
Don't Miss Out On The Next BIG Stock Move
Performance comparison Updated
EVENT DAY
Stock performance from the time of news release until the following 4pm ET market close
LAST PRICE AT
NEWS EVENT
SINCE EVENT
Multi-day stock performance from the time of the news release
LAST PRICE
VWAP
High:
MAX UP
High:
Low:
MAX DOWN
Low:
%
 POST NEWS RANGE
%
PRICE CHANGE
PRICE CHANGE PERCENTAGE
S&P 500 (SPX)
%
 VOLUME RATIO
%
VOLUME (SHARES)
TICKS
AVG SHARES PER TRADE
EVENT DAY
Event Day Chart will not be displayed beyond 90-day period of the event
PERFORMANCE SINCE EVENT
TIME AND VELOCITY ANALYSIS