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Introducing Automotive-Qualified System-in-Package Hybrid MCU for Automotive and E-Mobility Human-Machine Interface Applications
Last microchip technology incorporated earnings: 2/4 04:10 pm
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US:NASDAQ Investor Relations: microchip.com/investors
CHANDLER, Ariz., March 24, 2026 (GLOBE NEWSWIRE) -- Automotive and E-Mobility designers are incorporating more Human-Machine Interfaces (HMIs) with sophisticated graphics to enhance the user experience. To address the growing demand for HMI solutions, Microchip Technology (Nasdaq: MCHP) today announces the AEC-Q100 Grade 2-qualified, SAM9X75D5M System-in-Package (SiP) with an Arm926EJ-S™ processor and 512 Mbit DDR2 SDRAM. The SAM9X75D5M supports large display sizes up to 10 inches and XGA resolution of 1024 × 768 pixels. The SAM9X75D5M is part of Microchip’s hybrid MCU family that enables users to capitalize on the advanced processing capabilities of a microprocessor (MPU) with access to embedded, higher memory densities while maintaining the familiar development environment of MCU-based designs, and the option to develop using Real-Time Operating Systems (RTOS). Tailored for automotive applications such as digital cockpit clusters, smart clusters for two- and three-wheelers, HVAC
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