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Stockreport

Micron First to Ship Critical Memory for AI Data Centers [Yahoo! Finance]

Micron Technology, Inc. (MU)  More Company Research Source: Yahoo! Finance
Last micron technology, inc. earnings: 3/25 04:01 pm Check Earnings Report
US:NASDAQ Investor Relations: investors.micron.com
BOISE, Idaho, May 01, 2024 (GLOBE NEWSWIRE) -- Micron Technology, Inc. (Nasdaq: MU), today announced it is leading the industry by validating and shipping its high-capacity monolithic 32Gb DRAM die-based 128GB DDR5 RDIMM memory in speeds up to 5,600 MT/s on all leading server platforms. Powered by Micron's industry-leading 1ß (1-beta) technology, the 128GB DDR5 RDIMM memory delivers more than 45% improved bit density, up to 22% improved energy efficiency and up to 16% lower latency over competitive 3DS through-silicon via (TSV) products. Micron's collaboration with industry leaders and customers has yielded broad adoption of these new high-performance, large-capacity modules across high-volume server CPUs. These high-speed memory modules were engineered to meet the performance needs of a wide range of mission-critical applications in data centers, including artificial intelligence (AI) and machine learning (ML), high-performance computing (HPC), in-memory databases (IMDBs) and effi [Read more]

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Stockreport

Micron First to Ship Critical Memory for AI Data Centers [Yahoo! Finance]

Micron Technology, Inc.  (MU) 
Last micron technology, inc. earnings: 3/25 04:01 pm Check Earnings Report
US:NASDAQ Investor Relations: investors.micron.com
BOISE, Idaho, May 01, 2024 (GLOBE NEWSWIRE) -- Micron Technology, Inc. (Nasdaq: MU), today announced it is leading the industry by validating and shipping its high-capacity monolithic 32Gb DRAM die-based 128GB DDR5 RDIMM memory in speeds up to 5,600 MT/s on all leading server platforms. Powered by Micron's industry-leading 1ß (1-beta) technology, the 128GB DDR5 RDIMM memory delivers more than 45% improved bit density, up to 22% improved energy efficiency and up to 16% lower latency over competitive 3DS through-silicon via (TSV) products. Micron's collaboration with industry leaders and customers has yielded broad adoption of these new high-performance, large-capacity modules across high-volume server CPUs. These high-speed memory modules were engineered to meet the performance needs of a wide range of mission-critical applications in data centers, including artificial intelligence (AI) and machine learning (ML), high-performance computing (HPC), in-memory databases (IMDBs) and effi [Read more]

IMPACT SNAPSHOT
EVENT TIME:
MU
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Price Change %
Volume Shares
Max Up
Max Down
Volume Ratio
%
Don't Miss Out On The Next BIG Stock Move
Performance comparison Updated
EVENT DAY
Stock performance from the time of news release until the following 4pm ET market close
LAST PRICE AT
NEWS EVENT
SINCE EVENT
Multi-day stock performance from the time of the news release
LAST PRICE
VWAP
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High:
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Low:
%
POST NEWS RANGE
%
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S&P 500 (SPX)

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Event Day Chart will not be displayed beyond 90-day period of the event
PERFORMANCE SINCE EVENT
TIME AND VELOCITY ANALYSIS