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UMC Introduces Industry’s First 3D IC Solution for RFSOI, Accelerating Innovations in the 5G Era

United Microelectronics Corporation (NEW)  (UMC) 
US:NYSE Investor Relations: umc.com/english/investors/index.asp
PDF News Highlights:UMC's 3D IC solution for RFSOI reduces circuit footprint by more than 45%, enabling integration of more RF components in 5G-enabled devices.UMC's innovat [Read more]