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Stockreport

Intevac to Present its Work on Fan-Out Packaging at SEMICON Korea 2018 Technology Symposium

INTEVAC (IVAC)  More Company Research Source: Business Wire
Last intevac earnings: 4/30 04:05 pm Check Earnings Report
US:NASDAQ Investor Relations: investor.intevac.com/events.cfm
PDF SANTA CLARA, Calif.--(BUSINESS WIRE)-- Intevac, Inc. (Nasdaq: IVAC), a leading supplier of thin-film processing systems, today announced its participation in the SEMICON Korea 2018 Electropackage System and Interconnect Product Technical Symposium. The company will present a technical paper on its “Ion Beam Source for RDL Pre-Clean in Fan-Out Wafer and Fan-Out Panel Level Packaging” at 4:15pm Thursday afternoon, February 1st, 2018, in Seoul, Korea, at the COEX exhibition center. Semiconductor device packaging technology in general, and fan-out wafer-level packaging (FOWLP) / fan-out panel-level packaging (FOPLP) technology in particular, is being driven by the strong cost advantages these advanced packaging technologies offer over the expense of implementing continued Moore’s Law progress for sub-10nm semiconductor IC process nodes. Fan-out packaging provides for increased I/O (Input/Output) density for [Read more]

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