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Stock impact report

ACM Research Delivers First Horizontal Panel Electroplating Tool Strengthening Its Leadership in Fan-Out Panel-Level Packaging

ACM Research, Inc. - Class A (ACMR) 
Last acm research, inc. - class a earnings: 3/18 04:10 pm Check Earnings Report
US:NASDAQ Investor Relations: ir.acmrcsh.com
Company Research Source: GlobeNewswire
ACM’s Ultra ECP ap-p enables next generation device performance amid accelerating market demand for advanced packaging SEMICON EUROPA, Munich, Nov. 16, 2025 (GLOBE NEWSWIRE) -- ACM Research, Inc. (“ACM”) (NASDAQ: ACMR), a leading supplier of wafer and panel processing solutions for semiconductor and advanced packaging applications, today announced it has delivered the first panel electrochemical plating tool, the Ultra ECP ap-p, to an industry-leading panel fabrication customer. This achievement underscores ACM’s advancement in panel-level electroplating technology and reflects growing market demand for scalable, cost-efficient advanced packaging solutions to meet next generation device requirements. The Ultra ECP ap-p is the first commercial panel-level copper deposition system for the large-panel market, supporting plating steps across pillar, bump, and redistribution layer (RDL) processes. The system achieves panel-processing performance - comparable to traditional round wafer Show less Read more
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