Arizona State University and Deca Technologies to Pioneer North America's First R&D Center for Advanced Fan-Out Wafer-Level Packaging [Yahoo! Finance]
Amkor Technology, Inc. (AMKR)
Last amkor technology, inc. earnings: 4/27 04:03 pm
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Source: Yahoo! Finance
TEMPE, Ariz., March 19, 2024 (GLOBE NEWSWIRE) -- Arizona State University (ASU) and Deca Technologies (Deca), a premier provider of advanced wafer- and panel-level packaging technology, today announced a groundbreaking collaboration to create North America's first fan-out wafer-level packaging (FOWLP) research and development center. The new Center for Advanced Wafer-Level Packaging Applications and Development is set to catalyze innovation in the United States, expanding domestic semiconductor manufacturing capabilities and driving advancements in cutting-edge fields such as artificial intelligence, machine learning, automotive electronics and high-performance computing. The center will combine state-of-the-art advanced-packaging technology, equipment, processes, materials, expertise and training, fostering the development of new capabilities from proof of concept to pilot scale. ASU is the first university implementation of Deca's M-Series™ fan-out and Adaptive Patterning ® tec
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News
- Should You Think About Buying Amkor Technology, Inc. (NASDAQ:AMKR) Now? [Yahoo! Finance]Yahoo! Finance
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- System in Package Die Market Size Projections Exhibit a CAGR of 9.4%, Likely to Attain a Value of USD 23.3 Billion by 2033 [Yahoo! Finance]Yahoo! Finance
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- Global Advanced Semiconductor Packaging Industry Report 2024-2035 with Profiles of 125+ Key Players Including Samsung, TSMC, Intel, 3DSEMI and SJ Semiconductor Among Others [Yahoo! Finance]Yahoo! Finance
AMKR
Earnings
- 2/5/24 - Beat
AMKR
Sec Filings
- 4/18/24 - Form 4
- 4/16/24 - Form 144
- 4/16/24 - Form PX14A6G
- AMKR's page on the SEC website