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0 -0.00397675130009185 -0.00581217497705735 -0.0040379320893241 -0.003670847353931 -0.0110125420617928 -0.0140715815234017 -0.0128479657387581
Stock impact report

Global Semiconductor & IC Packaging Materials Market Report 2024: SOP Packaging Technology to Lead Market Between 2024 and 2029 [Yahoo! Finance]

Amkor Technology, Inc. (AMKR) 
Last amkor technology, inc. earnings: 4/27 04:03 pm Check Earnings Report
US:NASDAQ Investor Relations: amkortech.gcs-web.com/investor-relations
Company Research Source: Yahoo! Finance
Materials Market by Type (Organic substrate, Bonding wires, Leadframes, Encapsulation resins, Ceramic packages, Die attach materials, Solder balls), Packaging Technology, End-use industry, and Region - Forecast to 2029" report has been added to ResearchAndMarkets.com's offering. The Semiconductor & IC packaging materials Market is projected to reach USD 70.9 billion by 2029, at a CAGR of 10.1% from USD 43.9 billion in 2024. The semiconductor and IC packaging materials market experiences dynamic growth fueled by various pivotal factors. Firstly, there is a rising demand for advanced packaging solutions due to continuous technological advancements in semiconductor devices. This demand is further boosted by the expanding market for consumer electronics and IoT devices, which require efficient and innovative packaging materials. Additionally, the industry witnesses a surge in the need for compact and lightweight packaging solutions, aligning with the trend of miniaturization in electron Show less Read more
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