ASE’s VIPack™ Enables Innovational AI Devices Through Advanced Interconnect Technology for Chiplets
ASE Technology Holding Co., Ltd. American Depositary Shares (each representing Two Common Shares) (ASX)
Last ase technology holding co., ltd. american depositary shares (each representing two common shares) earnings: 2/7 01:00 am
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ir.aseglobal.com
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Source: Business Wire
SUNNYVALE, Calif.--(BUSINESS WIRE)--Advanced Semiconductor Engineering, Inc. (ASE), a member of ASE Technology Holding Co., Ltd. (NYSE: ASX) (TAIEX: 3711), today announced that it has extended its advanced interconnect technology under the VIPack™ platform to meet the accelerating demand for complex chiplet integration for artificial intelligence (AI) applications. This interconnect extension advances roadmap capabilities from a chip-on-wafer interconnect pitch of 40um to 20um through advanced microbump technology. Such new interconnect solutions are crucial for architects seeking to accomplish creativity and scale across 2D, or side-by-side, solutions as well as newer vertically integrated solutions, such as 2.5D and 3D packaging capabilities, under ASE’s VIPack™ platform.As the chiplet design approach accelerates, ASE’s advanced interconnect technology allows designers to consider innovative, high density chiplet integration options where there might normally be chip IO density
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- Advanced Packaging Market Aims for Remarkable Growth, Targeting USD 79.9 Billion by 2033 at 8.4% CAGR [Yahoo! Finance]Yahoo! Finance
- ASE Technology Holding Co., Ltd. Reports Its Unaudited Consolidated Financial Results for the First Quarter of 2024PR Newswire
- ASE Technology Holding Co., Ltd. Announces Monthly Net Revenues*PR Newswire
- ASE TECHNOLOGY HOLDING CO., LTD. Files 2023 Annual Report On Form 20-FPR Newswire
- ASE Technology Holding Co., Ltd. Announces Monthly Net Revenues*PR Newswire
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