BE Semiconductor Falls on HBM Standard Change Concerns [Yahoo! Finance]
BE SMCNDCTR INDUS S/ADR (BESIY)
NASDAQ:AMEX Investor Relations:
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Source: Yahoo! Finance
This article first appeared on GuruFocus BE Semiconductor Industries (BESI) shares dropped intraday in Amsterdam trading after a report suggested that memory chipmakers may delay adopting the company's hybrid bonding technology for high-bandwidth memory (HBM). The selloff followed a report from South Korean technology outlet ZDNet Korea, which cited discussions among JEDEC members, including Samsung Electronics and SK Hynix, about raising the package thickness limit for next-generation high-bandwidth memory chips. According to the report , the current HBM4 standard sits at 775 micrometers, and industry participants are weighing a range of 825 to 900 micrometers or more for future generations, including HBM4E and HBM5, which may require 20-layer DRAM stacking. Hybrid bonding is a key technology used to connect stacked semiconductor layers in advanced packaging, enabling higher performance and efficiency in AI-focused memory solutions. According to Degroof Petercam analyst Michae
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