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0 0.0213523131672598 0.0213523131672598 -0.00444839857651252 0.0302491103202847 0.0355871886120997 0.0284697508896797 0.0640569395017794
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Intevac Announces MATRIX Order for Fan-Out Applications in the Advanced Semiconductor Packaging Market

Intevac, Inc. (IVAC) 
Last intevac, inc. earnings: 4/27 04:05 pm Check Earnings Report
US:NASDAQ Investor Relations: investor.intevac.com/events.cfm
Company Research Source: Business Wire
SANTA CLARA, Calif.--(BUSINESS WIRE)--Intevac, Inc. (Nasdaq: IVAC), a leading supplier of thin-film processing systems, today announced an INTEVAC MATRIX® PVD order for fan-out applications in the advanced semiconductor packaging market. This order follows the successful completion of the fan-out evaluation program with a leading outsourced assembly and test company (OSAT) in March 2021, and the system will be both booked and recognized as revenue in the first quarter of 2021.“The successful completion of the evaluation program, and subsequent purchase order and customer acceptance of the tool, is important validation that the MATRIX PVD fan-out wafer- and panel-level system meets the requirements for the next-generation advanced semiconductor packaging market,” commented Wendell Blonigan, president and chief executive officer of Intevac. “We are pleased to have surmounted pandemic-related challenges, including international travel restrictions, in order to complete the evaluation Show less Read more
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