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0.00115954477131205 0.00109512561735033 0.00300622718488305 0.00717199914107802 0.00085892205282378 0.0063560231908955 0.00536826283014829 0.00560446639467471
Stock impact report

Keysight Unveils 3D Interconnect Designer for Chiplet and 3DIC Advanced Package Designs

Keysight Technologies Inc. (KEYS) 
Last keysight technologies inc. earnings: 2/24 04:05 pm Check Earnings Report
Company Research Source: Business Wire
Solution addresses design bottleneck by automating complex workflows SANTA ROSA, Calif.--(BUSINESS WIRE)--Keysight Technologies, Inc. (NYSE: KEYS) today introduced 3D Interconnect Designer, a new addition to its Electronic Design Automation (EDA) portfolio. The solution addresses the mounting complexity of designing 3D interconnects for high-chiplet and 3DIC advanced packages used in AI infrastructure and data center applications.This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260217842809/en/3D Interconnect Designer simplifies high-speed 3D interconnect design for silicon bridges and interposers.As chiplet architectures are increasingly adopted, engineers face complex 3D interconnect designs for multi-die and stacked-die applications which traditional workflows struggle to handle efficiently. As a result, teams spend significant time manually optimizing the interconnects that include vias, transmission lines, solder ball Show less Read more
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