IIT Prints 3D Embedded Sensors in Electrical Packaging for Next Generation MEMS Devices Using Nano Dimension’s DragonFly System
Nano Dimension Ltd. - American Depositary Shares (NNDM)
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Source: GlobeNewswire
Istituto Italiano di Technologia plans to use the packaging for rapid device and microsystem prototyping of micro-electro-mechanical systems and wearable transducers NESS ZIONA, Israel, Sept. 26, 2019 (GLOBE NEWSWIRE) -- Nano Dimension Ltd., a leading additive electronics provider for electronics (NASDAQ, TASE: NNDM), announced today that one of its customers, the Center for Biomolecular Nanotechnologies (CBN) of the Istituto Italiano di Tecnologia (IIT), is using the DragonFly additive manufacturing system to 3D print embedded sensors in electrical packaging. IIT is a leading research institute in Italy with the mission of promoting technological development and higher education in science and technology. IIT plans to use the electrical packaging for rapid device and microsystem prototyping of next generation micro-electro-mechanical systems (MEMS) and wearable transducers for information and communication technology (ICT) and biomedical applications. IIT researchers wil
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