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-0.0101283847408189 0.00480007349394827 0.0002067017294046 -0.00181438184699464 -0.00438667003513927 0.0134126455524679 0.142601226430261 0.20231505936933
Stock impact report

Navitas Adds Top-Side Cooled QDPAK and Low-Profile TO-247-4L to its Package Line-Up in the Latest 5th Generation GeneSiC™ Technology

Navitas Semiconductor Corporation (NVTS) 
Company Research Source: GlobeNewswire
TORRANCE, Calif., March 11, 2026 (GLOBE NEWSWIRE) -- Navitas Semiconductor (Nasdaq: NVTS), an industry leader in next-generation GaNFast™ gallium nitride (GaN) and GeneSiC™ silicon carbide (SiC) power semiconductors, today announced the launch of two new packages: top-side cooled QDPAK and a low-profile TO-247-4L with asymmetrical leads in its 5th generation GeneSiC™ technology platform. The latest 1200 V SiC MOSFET products set a new industry benchmark for power density and ruggedness. 5th generation Trench-Assisted Planar (TAP) technologyThis technology delivers 35% improvements in RDS,ON × QGD figure of merit (FoM), and about 25% improvement in QGD / QGS ratio. When coupled with stable high threshold voltage, VGS,TH, of 3 V, this technology ensures immunity against parasitic turn-on, providing a robust and predictable switching performance. Top-side cooled (TSC) QDPAKThe QDPAK package is designed to overcome the thermal limitations of conventional PCB cooling by enabling heat d Show less Read more
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