onsemi’s Treo Platform Selected by Teledyne for Advanced Infrared Imaging Design
ON Semiconductor Corporation (ON)
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Source: GlobeNewswire
SCOTTSDALE, Ariz., Oct. 28, 2025 (GLOBE NEWSWIRE) -- onsemi today announced that Teledyne Technologies has selected its Treo platform to develop next-generation readout integrated circuit (ROIC) application-specific integrated circuits (ASICs) for infrared imaging systems. As the industry’s most advanced analog and mixed-signal platform, Treo can be combined with specialized ROIC modules to meet the demands of infrared focal plane array (FPA) systems, which are essential to a wide range of aerospace, defense, security, and scientific applications. Built on an advanced 65nm node, the Treo platform features a modular architecture and a rich set of IP building blocks that help speed up development and reduce time-to-market. Its ROIC process technology combines onsemi’s established ROIC offering with Treo’s precision analog, advanced digital, and low-voltage power features to deliver a powerful, differentiated solution. Key Features Higher gate density to allow for more functionali
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- onsemi and Innoscience Announce Plans to Collaborate to Speed Global Rollout of GaN Power PortfolioGlobeNewswire
- Morgan Stanley Lifts PT on ON Semiconductor (ON) Stock [Yahoo! Finance]Yahoo! Finance
- ON Semiconductor (NASDAQ:ON) had its price target raised by analysts at Morgan Stanley from $55.00 to $56.00. They now have an "equal weight" rating on the stock.MarketBeat
- onsemi Announces $6 Billion Share Repurchase AuthorizationGlobeNewswire
- ON Semiconductor: Stabilizing Margins And A Reasonable Entry Point (Upgrade) [Seeking Alpha]Seeking Alpha
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