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Stock impact report

Onto Innovation Debuts Sub-surface Defect Inspection for Advanced Packaging

Onto Innovation Inc. (ONTO) 
Last onto innovation inc. earnings: 2/6 04:05 pm Check Earnings Report
Company Research Source: Business Wire
New capability released for the Dragonfly® G3 inspection system enables 100% wafer inspection for critical sub-surface defectsOnto has received multiple orders in support of high bandwidth memory (HBM), advanced logic and a variety of specialty segments WILMINGTON, Mass.--(BUSINESS WIRE)--Onto Innovation Inc. (NYSE: ONTO) today announced the release of a new sub-surface inspection capability for the Dragonfly® G3 sub-micron 2D/3D inspection and metrology platform. The new capability enables whole wafer inspection for critical yield impacting defects that can lead to lost die as well as entire wafers breaking in subsequent process steps. Such defects were previously impossible to find in a production environment. In today’s world of wafer thinning and multi-layer wafer or die bonding, sub-surface defects are far more dangerous than ever before as bonded layers are now a tenth of their former thickness and far more brittle and therefore more susceptible to damage pre- or post-bonding Show less Read more
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