Panasonic to Team up with IBM Japan in Improving Semiconductor Manufacturing Processes
PANASONIC HLDS CP S/ADR (PCRFY)
NASDAQ:AMEX Investor Relations:
panasonic.com/global/corporate/ir.html
Company Research
Source: Business Wire
Co-development of new high-value-added system to reduce engineering costs, stabilize product quality, and improve factory productivity OSAKA, Japan--(BUSINESS WIRE)--On October 15, 2019, IBM Japan, Ltd. and Panasonic Corporation’s subsidiary, Panasonic Smart Factory Solutions Co., Ltd. (hereafter "Panasonic"), announced that the companies have agreed to collaborate to develop and market a new high-value-added system to optimize the overall equipment effectiveness (OEE) of customers’ semiconductor manufacturing processes and to realize high-quality manufacturing.This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20191014005718/en/Aims of the collaboration (Graphic: Business Wire)As part of its circuit formation process business, Panasonic currently develops and markets edge devices and manufacturing methods that contribute to improving semiconductor manufacturing of advanced packaging. These new devices and methods include dry
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