Renesas Develops 3nm TCAM Technology Combining High Memory Density and Low Power, Suitable for Automotive SoCs
RENESAS ELECTRON UNSP/ADR (RNECY)
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Source: Business Wire
Achieves flexible, small-block configuration for large-scale TCAMsCuts search energy and boosts speed through efficient search processingEnhanced functional safety enables application beyond networking to automotive SoCsNew technology presented at ISSCC 2026 in San Francisco TOKYO & SAN FRANCISCO--(BUSINESS WIRE)--Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today announced a configurable ternary content-addressable memory (TCAM) built on a 3nm FinFET process. The new TCAM simultaneously delivers higher density, lower power and strengthened functional safety, making it suitable for automotive applications. Renesas presented the results at the International Solid-State Circuits Conference 2026 (ISSCC 2026), held February 15–19 in San Francisco, USA.This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260218770189/en/With the rapid expansion of 5G and cloud/edge computing, n
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