Renesas Develops SoC Technologies for Automotive Multi-Domain ECUs Essential for the SDV Era
RENESAS ELECTRON UNSP/ADR (RNECY)
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Company Research
Source: Business Wire
Scalability and functional safety enabled by chiplet technologyAuto-grade quality for large, modern AI NPUsAdvanced power control for higher performance, improved power efficiency and safetyNew technology presented at ISSCC 2026 in San Francisco TOKYO & SAN FRANCISCO--(BUSINESS WIRE)--Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, has developed three System-on-Chip (SoC) technologies for automotive multi-domain electronic control units (ECUs). They feature advanced AI processing capabilities and chiplet functions, serving as the core technology platform for next-generation automotive electrical/electronic (E/E) architectures. Renesas presented the results at the International Solid-State Circuits Conference 2026 (ISSCC 2026), held February 15–19 in San Francisco, USA.This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260218380401/en/In the age of software-defined vehicles
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