ROHM Releases DOT-247: Integrated 2-in-1 SiC Molded Module for Industrial Applications
ROHM CO LTD UNSP/ADR (ROHCY)
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Source: GlobeNewswire
Santa Clara, CA and Kyoto, Japan, Sept. 16, 2025 (GLOBE NEWSWIRE) -- ROHM Semiconductor today announced the development of the DOT-247, a new 2-in-1 SiC molded module (SCZ40xxDTx, SCZ40xxKTx) designed for industrial applications such as PV inverters, UPS systems, and semiconductor relays. This innovative module combines the proven versatility of the widely adopted TO-247 package with enhanced design flexibility and superior power density. The DOT-247’s unique dual TO-247 structure enables the integration of larger chips that were previously difficult to accommodate. A unique internal structure achieves lower on-resistance, while package optimizations reduce thermal resistance by approximately 15% and inductance by about 50% compared to conventional TO-247 solutions. This translates to a 2.3x higher power density in a half-bridge configuration, delivering the same power conversion capability in nearly half the volume. The new products are offered in two topologies: half-bridge an
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