Tower Semiconductor Announces New CPO Foundry Technology Available On Tower’s Leading Sipho and EIC Optical Platforms
Tower Semiconductor Ltd. - Ordinary Shares (TSEM)
Last tower semiconductor ltd. - ordinary shares earnings: 2/18 04:06 am
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Source: GlobeNewswire
Leveraging years of stacked BSI sensor production, Tower’s wafer-scale 3D-IC technology unlocks integration of SiPho and EIC processes for emerging applications such as Co-Packaged Optics, including full support by Cadence design tools to the stacked platform technology Migdal Haemek, Israel – November 12, 2025 – Tower Semiconductor (NASDAQ/TASE: TSEM), a leading foundry of high-value analog semiconductor solutions, today announced the expansion of its existing, mature 300mm wafer bonding technology, originally developed and in mass production for stacked BSI image sensors, to enable heterogeneous 3D-IC integration across its industry-leading Silicon Photonics (SiPho) and SiGe BiCMOS processes, including full support by Cadence design tools for the stacked platform technology. The new offering, represents a major step forward in extending wafer-scale 3D integration, requiring simultaneous use of multiple-PDKs, to new domains beyond image sensing, addressing the growing market demand
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News
- Tower Semiconductor to Attend the Barclays 23rd Annual Global Technology ConferenceGlobeNewswire
- Tower Semiconductor (NASDAQ:TSEM) had its "hold (c)" rating reaffirmed by analysts at <a style="font-weight:bold" href="https://weissratings.com/">Weiss Ratings</a>.MarketBeat
- Tower Semiconductor (NASDAQ:TSEM) had its "hold (c)" rating reaffirmed by analysts at <a style="font-weight:bold" href="https://weissratings.com/">Weiss Ratings</a>.MarketBeat
- Katamaran Capital Loads Up on Tower Semiconductor Stock, Buying 74,000 Shares [Yahoo! Finance]Yahoo! Finance
- Tower Semiconductor and Switch Semiconductor Collaborate to Deliver Best-in-Class Efficiency for Next-Generation AI and Server Power Systems [Yahoo! Finance]Yahoo! Finance
TSEM
Earnings
- 11/10/25 - Beat
TSEM
Sec Filings
- 12/3/25 - Form 6-K
- 11/19/25 - Form 144
- 11/17/25 - Form 6-K
- TSEM's page on the SEC website