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Stock impact report

Advanced IC Packaging: Worldwide Technologies, Materials and Markets to 2022 - Covering Multichip Packaging, Technology Trends, Key Application Forecasts, and Company Profiles

ASE Technology Holding Co., Ltd. American Depositary Shares (each representing Two Common Shares) (ASX) 
Last ase technology holding co., ltd. american depositary shares (each representing two common shares) earnings: 2/7 01:00 am Check Earnings Report
US:NYSE Investor Relations: ir.aseglobal.com
Company Research Source: PR Newswire
DUBLIN, March 8, 2019 /PRNewswire/ -- The "Advanced IC Packaging Technologies, Materials, and Markets 2018 Edition" report has been added to ResearchAndMarkets.com's offering.The demand for consumer electronics and mobile communications devices that keep us connected is driving electronics manufacturers to deliver ever-more compact and portable products. Today's users ask for solutions that deliver more functionality, added performance, higher speed, and smaller form factors. Software systems and billions of networked devices are rapidly coalescing into a vast Internet of Things.All of these forces are driving semiconductor companies to develop new advanced IC packaging technologies to provide greater silicon integration in increasingly miniaturized packages. The last decade has seen an explosion of new products including fan-out wafer-level packaging (FOWLPs), stacked IC packages and complex system-in-packages (SiPs), as well as advances in package substrates, flip chip interconnecti Show less Read more
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